• High-Temperature Waterproof PCB Epoxy Resin Rubber Electronic Components Potting Compound Sealant Glue
  • High-Temperature Waterproof PCB Epoxy Resin Rubber Electronic Components Potting Compound Sealant Glue
  • High-Temperature Waterproof PCB Epoxy Resin Rubber Electronic Components Potting Compound Sealant Glue
  • High-Temperature Waterproof PCB Epoxy Resin Rubber Electronic Components Potting Compound Sealant Glue
  • High-Temperature Waterproof PCB Epoxy Resin Rubber Electronic Components Potting Compound Sealant Glue
  • High-Temperature Waterproof PCB Epoxy Resin Rubber Electronic Components Potting Compound Sealant Glue

High-Temperature Waterproof PCB Epoxy Resin Rubber Electronic Components Potting Compound Sealant Glue

CAS No.: 7085-85-0
Formula: N/a
EINECS: 230-391-5
Molecular Principal Chain: Carbon Chain Polymer
Color: Black
Appearance: Black Liquid
Samples:
US$ 4/kg 1 kg(Min.Order)
| Request Sample
Customization:
Gold Member Since 2020

Suppliers with verified business licenses

Manufacturer/Factory, Trading Company

Basic Info.

Type
Power Potting Material, Silicone Sealant
Classification
Double Components Adhesives
Advantage
High Sealing Property
Shelf Life
12 Months
Delivery Time
10~15 Days
Application
Sealing
Main Raw Material
Silicone/PU/Epoxy
Usage
Construction, Fiber & Garment, Footwear & Leather
Transport Package
Barrel
Specification
25kg/barrel (customized available)
Trademark
SWETE
Origin
China
Production Capacity
150 Ton/Tons Per Month

Product Description

Products Description

High-Temperature Waterproof PCB Epoxy Resin Rubber Electronic Components Potting Compound Sealant Glue

Product Data
ITEM
WD870
Appearance
A:Black viscous liquid
B: White viscous liquid
Viscosity,cps,25ºC
A&B: 3500±1000
Density (g/cm³)
1.63±0.02
Mixing Ratio
100:100
Viscosity after mixing, 4# rotor, cps, 25 ºC
3500±1000
Operation time after mixing cps. 25ºC(min)
40±10
After mixing, table dry time, cps, 25ºC
80±20
Hardening conditions
25ºC:3-5 hr or 80ºC:30mins
Feature after cured
Appearance
Gray, flexible elastomer
Hardness (Shore A)
50±5
Thermal conductivity, W/mK
1.0
Linear expansion coefficient, K-1,ppm
210
Dielectric strength, kV/mm, 25ºC
25
Volume resistance, DC 500V, Ω CM
1.1*1014
Loss factor(1 MHz)
0.009
Dielectric constant (1 MHz)
3.00
Temperature range, ºC
-60~200
Flame Resistance, UL-94
V-0

Usage

High-Temperature Waterproof PCB Epoxy Resin Rubber Electronic Components Potting Compound Sealant Glue


High-Temperature Waterproof PCB Epoxy Resin Rubber Electronic Components Potting Compound Sealant GlueHigh-Temperature Waterproof PCB Epoxy Resin Rubber Electronic Components Potting Compound Sealant GlueHigh-Temperature Waterproof PCB Epoxy Resin Rubber Electronic Components Potting Compound Sealant Glue

Applicaiton
It is supplied in lot matched kits consisting of Part A and Part B in separate containers. 
During long periods of storage, some of the filler may settle at the bottom of the containers and should be individually homogenised prior to use. 
The two components should be thoroughly mixed using a weight ratio of 1:1 until the mixture has a uniform colour. Vacuum de-airing is recommended. A residual pressure of 10-20 mm mercury applied for 5-10 minutes will sufficiently de-air the material.


Package
Part A: 25kg/barrel,200kg/Drum.
Part B: 25kg/barrel,200kg/Drum.

High-Temperature Waterproof PCB Epoxy Resin Rubber Electronic Components Potting Compound Sealant Glue
High-Temperature Waterproof PCB Epoxy Resin Rubber Electronic Components Potting Compound Sealant Glue

Factory and Production
 
High-Temperature Waterproof PCB Epoxy Resin Rubber Electronic Components Potting Compound Sealant Glue
Due to the storage conditions, this product may experience a small amount of precipitation during storage, which is a normal phenomenon. After stirring evenly, it can be used normally.


Delivery Time

below 2000KGs   7-15days
5000-20000KGs   15-25days



Shipping way

Samples: DHL, Fedex, TNT etc.
Cargo: By sea, by air, by railway etc.


High-Temperature Waterproof PCB Epoxy Resin Rubber Electronic Components Potting Compound Sealant Glue

High-Temperature Waterproof PCB Epoxy Resin Rubber Electronic Components Potting Compound Sealant Glue
High-Temperature Waterproof PCB Epoxy Resin Rubber Electronic Components Potting Compound Sealant Glue

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Gold Member Since 2020

Suppliers with verified business licenses

Manufacturer/Factory, Trading Company
Registered Capital
10000 HKD
Plant Area
>2000 square meters