Electronic Components Surface Encapsulation Use Epoxy Resin Ab Glue Potting Glue

• CAS No.: 1169ab-X-2
• Formula: (C11h12o3)N
• Molecular Principal Chain: Carbon Chain Polymer
• Color: Black
• Appearance: Colorless&Clear
• Usage: Electronic Components Potting
• Certificate: RoHS, Reach, PAHs, ASTM, En-71
• Type: Ab Glue, Resin 1169A-X/Hardener 1169b-X-2
• Classification: Double Components Adhesives
• Supply Ability: 100 Ton/Tons Per Month
• OEM: Avaliable
• Shelf Life: 6 Months
• Cure Condition: Room Temperature
• Advantage: Bubble Free and Self Leveling
• Density (G/M3): 1.07+0.05/0.95+0.03
• Brookfield DV2trv Test: 25 Centigrade Degree
• Mixing Ratio(by Volume): 0.89:1
• Mixing Ratio(by Weight): 1:1
• Viscosity (MPa.S): 300+100/500+200
• Transport Package: Barrel
• Specification: 5kg per bottle
• Trademark: SWETE
• Origin: China
• Production Capacity: 50000 Kilogram/Kilograms Per Week

Product Description

Products Description
 

Characteristics

Epoxy resin WD1169AB-X-2 is a two-component epoxy resin, low viscosity, colorless and transparent, good natural deaeration, good flexibility when curing at room temperature or heating, and good surface.

Application

Epoxy resin WD1169AB-X-2 is mainly used for surface encapsulation of LED light strips and light strips, jewelry glue, crystal crafts, signs, nameplates, badges, or transparent perfusion of electronic components.



Technical parameter

 

	Resin WD1169A-X	Hardener WD1169B-X-2
Color	Colorless&Clear	Colorless&Clear
Density (g/m3)	1.07+0.05	0.95+0.03
Viscosity (mPa·s)	300+100	500+200
Brookfield DV2TRV Test method	25ºC
Mixing ratio (by weight)	1 : 1
(By volume)	0.89 : 1

After mixing

	Resin+Hardener
Status	Fluid
Viscosity	350±50mPa.S
Brookfield DV2TRV Test method	25ºC
Operating time (100g, 25ºC)	50±5 min
Brookfield DV2TRV Test method, viscosity up to 840mPa•s
Dosage	280-350 g/m2(Depending on the base material)

Curing time
 

Initial curing	About 10-12 hrs at room temperature
Final curing	20 hrs at room temperature
Operating temperature range	10ºC-70ºC

Instructions

Working environment :Please keep the container clean. The parts A and B are proportioned strictly according to the weight ratio, accurately weighed, and fully stirred clockwise along the inner wall of the container, and then allowed to stand for 3-5 minutes before use.

 

Precautions: Adjust the amount of glue according to the operating time and amount to avoid waste. When the temperature is lower than 15ºC, please preheat the A glue to 30 ºC before adjusting the glue, easy to operate (A glue will thicken when the temperature is low); The lid must be sealed after use to avoid product scrap due to moisture absorption. When the relative humidity is greater than 85%, the surface of the cured product will easily absorb the moisture in the air and form a layer of white mist. Therefore, when the relative humidity is greater than 85%, it is not suitable for room temperature curing. It is recommended to use heated curing.

 

Test Results
 

Hardness	shoreD	58
Bending strength	Kg/mm2	28
Heat distortion	ºC	50
Water absorption	%	<0.1
Compressive strength	Kg/mm2	8.4

Storage

Whether freezing	Yes
Moisture sensitive	Resin	Hardener
	No	Sensitive
Recommended storage temperature	15ºC-25ºC(Not lower than 10ºC, not higher than 50ºC)
Valid period	6 months from the original packaging
Package	Resin	Hardener
	5 kg/pot	5 kg/pot

Due to the storage conditions, this product may experience a small amount of precipitation during storage, which is a normal phenomenon. After stirring evenly, it can be used normally.