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Electronic Components Surface Encapsulation Use Epoxy Resin Ab Glue Potting Glue pictures & photos
Electronic Components Surface Encapsulation Use Epoxy Resin Ab Glue Potting Glue pictures & photos
Electronic Components Surface Encapsulation Use Epoxy Resin Ab Glue Potting Glue pictures & photos
Electronic Components Surface Encapsulation Use Epoxy Resin Ab Glue Potting Glue pictures & photos
Electronic Components Surface Encapsulation Use Epoxy Resin Ab Glue Potting Glue pictures & photos
Electronic Components Surface Encapsulation Use Epoxy Resin Ab Glue Potting Glue pictures & photos
  • Electronic Components Surface Encapsulation Use Epoxy Resin Ab Glue Potting Glue
  • Electronic Components Surface Encapsulation Use Epoxy Resin Ab Glue Potting Glue
  • Electronic Components Surface Encapsulation Use Epoxy Resin Ab Glue Potting Glue
  • Electronic Components Surface Encapsulation Use Epoxy Resin Ab Glue Potting Glue
  • Electronic Components Surface Encapsulation Use Epoxy Resin Ab Glue Potting Glue
  • Electronic Components Surface Encapsulation Use Epoxy Resin Ab Glue Potting Glue
CAS No.: 1169ab-X-2
Formula: (C11h12o3)N
Molecular Principal Chain: Carbon Chain Polymer
Color: Black
Appearance: Colorless&Clear
Usage: Electronic Components Potting
Samples:
US$ 50/kg 1 kg(Min.Order)
| Request Sample
Customization:

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