• Factory Best Price Insulation Epoxy Resin Ab Glue Potting Glue for Electronic Components Surface Encapsulation
  • Factory Best Price Insulation Epoxy Resin Ab Glue Potting Glue for Electronic Components Surface Encapsulation
  • Factory Best Price Insulation Epoxy Resin Ab Glue Potting Glue for Electronic Components Surface Encapsulation
  • Factory Best Price Insulation Epoxy Resin Ab Glue Potting Glue for Electronic Components Surface Encapsulation
  • Factory Best Price Insulation Epoxy Resin Ab Glue Potting Glue for Electronic Components Surface Encapsulation
  • Factory Best Price Insulation Epoxy Resin Ab Glue Potting Glue for Electronic Components Surface Encapsulation

Factory Best Price Insulation Epoxy Resin Ab Glue Potting Glue for Electronic Components Surface Encapsulation

CAS No.: 38891-59-7
Formula: C15h16o2c2h7onc3h5ocl
EINECS: 231-072-3
Molecular Principal Chain: Carbon Chain Polymer
Color: Black
Appearance: Colorless&Clear
Samples:
US$ 5/kg 1 kg(Min.Order)
| Request Sample
Customization:
Gold Member Since 2020

Suppliers with verified business licenses

Manufacturer/Factory, Trading Company

Basic Info.

Model NO.
WD5882AB
Usage
Electronic Components Potting
Certificate
RoHS, Reach, PAHs, ASTM, En-71
Type
Liquid Coating
Classification
Double Components Adhesives
Supply Ability
100 Ton/Tons Per Month
OEM
Avaliable
Shelf Life
6 Months
Cure Condition
Room Temperature
Advantage
High Gloss, No Yellow, Crystal Clear, Selif-Leveling
Density (G/M3)
1.60~1.70/1.05~1.15
Mixing Ratio
5:1
Viscosity (MPa.S)
2000~4000
Transport Package
Barrel
Specification
5kg per bottle
Trademark
SWETE
Origin
China
Production Capacity
50000 Kilogram/Kilograms Per Week

Product Description

Products Description
 
Name Epoxy Resin
Material Epoxy Resin and Hardener
Epoxy Resin and Hardener Jewelry, DIY Artwork, Painting, Woodworking
Color Transparent
Advantage Great bonding capability, fast wet out, good flexibility, low odor
 Delivery Time 10-20 Days


Factory Best Price Insulation Epoxy Resin Ab Glue Potting Glue for Electronic Components Surface Encapsulation

High Thermal conductive liquid silicone Epoxy glue electronic potting compound

Circuit board waterproof adhesive electronic potting sealant silicone epoxy lamps potting sealant manufacturers electronic power LED thermal conductive adhesive

Factory Best Price Insulation Epoxy Resin Ab Glue Potting Glue for Electronic Components Surface Encapsulation
Characteristics

WD5882AB is two-component solvent-free type flame retardant room temperature curing epoxy potting adhesive with high thermal conductivity, cured at room or heat temperature.

It's designed for pouring and protecting Auto mobile parts and supply physical strength to the elements, where excellent properties and exceptional thermal shock at elevated temperatures are required.

Electronic potting compound is a kind of two components(5:1 mixing ratio) addition cure Epoxy with the characteristics of heat-conducting , low viscosity , inherent flame resistance ,waterproofing ,etc.

It can cure both at room temperature and heated temperature and the curing time can be accelerated by higher temperature.
 

Factory Best Price Insulation Epoxy Resin Ab Glue Potting Glue for Electronic Components Surface Encapsulation
 
 

Specification
 

PERPORTY Part A  Part B
Colour (Appearance) Black Viscous Liquid Brown liquid
Viscosity, cps , 25ºC 30000~40000  100~200
 Density (g/cm³) (GB/T 15223-1994)  1.60~1.70  1.05~1.15
 Mixture ratio (Weight Ratio)   A:B = 5:1
 Viscosity of mixture,4#rotor,cps , 25ºC   2000~4000
 Operation time,mins , 25ºC   30-50
 Cure condition   25ºC/4~6Hrs
 Cured appearance   Black  Elastomer 
 Hardness, Shore D   >80
Thermal conductivity,W/K.T  0.5
 Shear strength, Fe-Fe, MPa  >10
 dielectric loss angle tangent,1.2MHz  <0.01
 Volume resistance,DC 500V, Ω·CM  1.1×1014
 Breakdown voltage,kV/mm,25ºC  >18
Cure shrinkage,% <2
Dielectric constant(1 MHz) 3.3±0.1
Application temperature, ºC - 40 - 120
Flame resistance ( UL-94)  V-0
 
 
Direction for use

1. Mix the glue: the glue component in the original packaging after the full mixing (no filler can not stir), the A and B components according to the provisions of the quality ratio of mixing (see the table above the mixing ratio), stir even after potting, The time available after mixing is shown in the table above.
More than the available time, glue viscosity will be high, no longer suitable for perfusion. So each time with the amount of plastic should not be too much, otherwise it will cause a waste.

2. Curing: Cure conditions See table above. Curing speed and temperature-related, high temperature fast curing, winter temperature is low, curing time will be extended, a variety of plastic can be used curing curing method, at 80 ºC under the conditions of curing 2 to 3 hours. After the hardening of the glue can be assembled, the test generally need to cure 24 to 48 hours after the curing.

 
OPERATION PRECAUTION

1. Before using the A component of the compound must be in the original packaging to stir evenly
(because the long-term placement may be precipitation, stirring even after use, does not affect
performance).
2. Different seasons due to temperature changes in curing speed is different is normal, the winter
temperature is low curing will be slower. Above all kinds of plastic can be used heating curing method.
3. Some of the A, B components of the colloid in the low temperature conditions may occur crystallization,
agglomeration, which is normal; before use it can be placed in the oven at 80 ºC to melt, and then put to
room temperature after use Does not affect its performance.
4. In the mixing process, pay attention to the inner wall of the container must be folded back to the mixing,
to ensure the uniformity of plastic. Curing time is affected by temperature, winter can choose to use
winter formula
* Keep away from Children
* Avoid contact with eyes and skin. If contact with your skin, scrub first with soap water or alcohol, then rinse with water. If contact with your eyes, rinse with plenty of water, and seek medical treatment immediately.
* It is forbidden to build on the surface of the wet substrate.


Workshop
 
Factory Best Price Insulation Epoxy Resin Ab Glue Potting Glue for Electronic Components Surface Encapsulation
Warehouse

Factory Best Price Insulation Epoxy Resin Ab Glue Potting Glue for Electronic Components Surface Encapsulation

Laboratory

Factory Best Price Insulation Epoxy Resin Ab Glue Potting Glue for Electronic Components Surface Encapsulation

Factory Best Price Insulation Epoxy Resin Ab Glue Potting Glue for Electronic Components Surface Encapsulation

Factory Best Price Insulation Epoxy Resin Ab Glue Potting Glue for Electronic Components Surface Encapsulation


Shippment


Factory Best Price Insulation Epoxy Resin Ab Glue Potting Glue for Electronic Components Surface Encapsulation

Factory Best Price Insulation Epoxy Resin Ab Glue Potting Glue for Electronic Components Surface Encapsulation
Factory Best Price Insulation Epoxy Resin Ab Glue Potting Glue for Electronic Components Surface Encapsulation

Type of Payment

Factory Best Price Insulation Epoxy Resin Ab Glue Potting Glue for Electronic Components Surface Encapsulation

Send your message to this supplier

*From:
*To:
*Message:

Enter between 20 to 4,000 characters.

This is not what you are looking for? Post a Sourcing Request Now

You Might Also Like

Gold Member Since 2020

Suppliers with verified business licenses

Manufacturer/Factory, Trading Company
Registered Capital
10000 HKD
Plant Area
>2000 square meters