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Factory Best Price Insulation Epoxy Resin Ab Glue Potting Glue for Electronic Components Surface Encapsulation

Name: Factory Best Price Insulation Epoxy Resin Ab Glue Potting Glue for Electronic Components Surface Encapsulation
Brand: SHENZHEN WEIDA TECH LIMITED
SKU: xnRrvyLCbNcz
Price: 3.96 USD
Availability: InStock

Factory Best Price Insulation Epoxy Resin Ab Glue Potting Glue for Electronic Components Surface Encapsulation pictures & photos

CAS No.:	38891-59-7
Formula:	C15h16o2c2h7onc3h5ocl
EINECS:	231-072-3
Molecular Principal Chain:	Carbon Chain Polymer
Color:	Black
Appearance:	Colorless&Clear

Samples:	US$ 5/kg 1 kg(Min.Order) \| Request Sample

Customization:	Available \| Customized Request

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